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  • Mixed dielectric PCB M6+FR4 hybrid circuit and Rogers+FR4 printed circuit board
Mixed dielectric PCB M6+FR4 hybrid circuit and Rogers+FR4 printed circuit board

Mixed dielectric PCB M6+FR4 hybrid circuit and Rogers+FR4 printed circuit board

  • Product No.:202045235122
  • PCB board thickness:0.6MM,0.8MM,1.0MM,1.2MM,1.6MM,2.0MM,2.4MM
  • Layer count:1L.2L,4L,6L,8L,10L,12L,16L,18L,20L,24L,32L
  • PCB material:FR4,CEM,ROGERS,Mixed laminate ect
  • Copper thickness:0.5OZ,1OZ,1.5OZ,2OZ
  • Surface treatment:HASL LF,ENIG ect
  • Soldermask:Green,Black,Yellow,Blue ect
  • silkscreen:White,Black
  • D.K: 2.2 to 10.6
  • D.F:/
  • Min trace/gap:3mil
  • Online Inquiry

Mixed dielectric PCB M6+FR4 hybrid circuit and Rogers+FR4 printed circuit board


Why used Mixed Dielectrics for some High-Frequency PCB Applications

Combinations of low-CTE FR-4 and high-CTE PTFE circuit materials are sometimes used to fabricate composite circuits, with the different circuit materials handling different circuit functions. The composite circuit with the two materials yields an acceptable CTE for handling the temperatures of many fabrication processes as well as some end-use applications. 


Figure 1 shows an example of such a multifunction, multilayer circuit, where high-frequency

microstrip-based circuits are separated by FR-4 control Circuitry.PTFE laminates are commonly used for RF/microwave circuits due to their excellent electrical performance at higher frequencies. PTFE circuit materials typically exhibit a dissipation factor of around 0.002,signifying very low dielectric loss, whereas FR-4 materials typically have a dissipation factor of around 0.020 for much higher dielectric losses. The CTE values of the two materials are also much different, but the relatively low CTE of FR-4 can be an advantage in a multilayer circuit construction. The CTE for PTFE material is about 200 ppm/°C, compared to about 50 ppm/°C for some high-Tg FR-4 materials. But when the two circuit materials are combined, as in the multilayer circuit of Fig. 1, the CTE of the FR-4 layers helps to lower the overall CTE of the multilayer circuit.

The dimensional stability of FR-4 circuit materials can also benefit hybrid multilayer constructions also using PTFE. Those PTFE circuit laminates which are not reinforced with woven glass in the manner of FR-4 are less stable dimensionally than PTFE laminates with such reinforcement. But in a hybrid multilayer circuit with PTFE, the added FR-4 layers are typically reinforced by woven glass, improving the overall dimensional stability of the multilayer construction.
More details please kindly check the PDF file:
Benefits of Mixed Dielectrics When Used for High-Frequency PCB Applications


Mixed dielectric PCB Project show:




Fig 2:M6+FR4-Mixed laminate PCB For 100G module

Fig 3:Rogers+FR4 mixed dielectric PCB board

*Please send inquiry to [email protected] directly!!!