What kind of methods to determine component failures?

It is possible to identify defects with several tests. Failure analysis helps to understand the faults and their prevention, which improves both the production as well as assembly processes. Here are a few important ones:

1.Solderability test

Solderability defines the wetting of a metal or metal alloy surface by solder under minimum adequate conditions. Usually, the board manufacturing process itself is the cause of assembly difficulties. It is due to problems associated with oxidation and improper application of the solder mask. To reduce this failure, check components and pad solderability to ensure the robustness of the surface. It also helps to develop a reliable solder joint.

This testing assesses the strength and wetting quality of the solder by replicating the contact between the solder and the material. It determines the wetting force and the duration from contact to wetting force formation. Moreover, it identifies the cause of the fault. Applications of solderability testing include: 

--Evaluation of solder and flux

--Circuit board coating evaluation

--Quality control

To effectively utilize this testing, it is crucial to understand various surface conditions and adequate requirements of the testing method.

2.Contamination test

Contamination induces various problems such as corrosion, metallization, and degradation. The circuit board has to go through aggressive chemical solutions within its lifecycle. Such chemicals include etching liquid, fluxes, electrolytic solutions, etc. It is necessary to perform cleaning after the application of these chemicals. 

Contamination testing calculates the number of ionic contaminants present in the sample. This process involves immersing the circuit board into a sample solution. This solution dissolves the ionic impurities that change the composition of the solution and the values. Then, by comparing the actual level with the standard level, it is possible to analyze the severity of the contamination. There should be a focus on the cleaning process to avoid the risks of failures.

3.Micro-sectioning test

The micro-sectioning test, also known as cross-sectioning, inspects the following:

--Component defect

--Shorts or opens

--Thermo-mechanical breakdown

--Solder reflow processing failures

--Analysis of raw materials