Introduction for Formal PCB stackups by fabricators
Introduction for Formal PCB stackups by fabricators
Formal Stackups are designed by Fabricators, NOT PCB designers.
PCB designers create requirements that the fabricators use to design the stackup.
Fabricators can select from a wide variety of materials, like . . .
1.Cores,
2.PrePregs,
3.Glass Weaves
4.Resin Contents
5.Others
Fabricators make material choices that meet their manufacturing processes needs.
Here's what PCB Designers can do:
--When requesting a stackup let the fabricator know if the design is using VIPPO(Via In Pad Plated Over) or heavy copper.
--Let the fabricator know if you have CAF(Cathodic Anodic Filament) concerns or if you need high speed glass.
--For High-speed and RF you may want to specify martials that have low Df-Dissipation Factor ( signal attention at higher frequencies ) specs.
--Specify the Desired Overall Board Thickness +/- 10%
--PCB Designers Create Fab Drawings with Controlled Requirements, like . . .
50 OHM 0.005" TRACES L1 REF TO L2 +/- 10%
50 OHM 0.004" TRACES L3 REF TO L2 AND L4 +/- 10%
100 DIFF 0.004" TRACES, PITCH 12 (GAP + WIDTH = PITCH)
RF TRACES
50 RB/CPW 0.020" TRACES, PITCH 30 L1 REF TO L4 +/- 10%
Designers can add notes to the project Fab Drawing, like . . .
Reference Only: Refer to Fabricator Stackup.
Customer Approval is Required for Stackup Changes.
The requirements in the fab drawing will drive the stackup designed by the fabricator.
PCB Designers can use various calculators to approximate the stackup, however the final stackup needs to come from the fabricator that is creating and testing the PCB.
To know more:
What is the ideal RF( Radio frequency )PCB stack up?
what is stack up in PCB?
PCB Blog
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