Blind and Buried Vias

Figure 1
There are 3 kinds of Vias as Figure 1 showed.
1.Blind vias:A blind via connects an outer layer of the board to inner layers and doesn’t go through the entire board. 
2.Buried via:A buried via connects inner layers without reaching the outer layers.
3.Through hole:A through hole via goes all the way through, from top to bottom, connecting all layers. 
Sometimes, you can’t fit all your connections on one layer. This is where vias come to your rescue!   
Vias are barrel shaped vertical conductive holes that make connections between multiple layers of a PCB. The IPC defines eight different types of vias, but we’re going to talk about blind and buried vias; the two you’re most likely to work with.  

Blind and Buried Vias Within Layout
You can easily configure your vias within the constraint manager in the physical workspace. Standard clearance rules apply when placing the vias. It is not recommended to place a via directly between pads of a surface mount component (SMD) as solder flux could potentially get trapped and cause corrosion problems. If solder flux would be under the SMD, inspecting and diagnosing the issue between a pad and via would be difficult once the board is manufactured and assembled.