Test reports

Test reports

Hopetimepcb will perform a variety of tests over the course of PCB fabrication and assembly with the reports for these tests included in this section. An Electrical Test Report with the result from a Flying Probe Test or a Fixture (Bed Board) Test is always included in this section (See Electrical Testing for an overview of these methods ).Also, when required , Hopetimepcb can perform a HI pot Test and record results in this report section . Lastly , we can perform functional tests when test parameters are specified by the client,providing a functional test report afterward.

2.Peel Strength Report
Peel strength is a way to measure the bond strength of a material, typically an adhesive measured with average load per unit width of bond line. If required, we can perform a peel strength test and provide a report on this PCB’s peel strength.

3.Solderability Report
The Solderability Test Report is a description of our solderability test results, including test type, factors, and results. This report shows our testing methods, the test conditions, and how we measured and compared the final test results to reach a conclusion on the PCB’s solderability.

4.Cross Section Report
The Cross-Section Report includes a variety of cross-sections, micro-sections, and X-sections showing the physical design data for this PCB. In this section of the PCB report, physical data such as copper thickness, hole wall thickness , and solder mask thickness will be included . Hopetimepcb will provide cross-sections and various other diagrams showing the PCB’s various layers and micro-via.

5.Peel Strength Report
Peel strength is a way to measure the bond strength of a material, typically an adhesive measured with average load per unit width of bond line. If required, we can perform a peel strength test and provide a report on this PCB’s peel strength.

6. Impedance Report (TDR)
Impedance Report is an optional report that Hopetimepcb will provide if impedance data is required by the client . An impedance test is performed using a Time Domain Reflectometry (TDR ), the test results are recorded in this report along with the PCB ’s stack -up. A TDR test is performed by applying a very fast electrical step signal to the PCB using a controlled impedance cable and probe. The TDR testing equipment records and graphs the changes in impedance value using the part of the signal, which is reflected back. This graph data shows the impedance values for that PCB or the values simulated by the TDR test with average,standard deviation , minimum and maximum values. (See section 10.0 Controlled Impedance PCB for more information)

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