There are 7 main ways to control the heat dissipation of a electronic board.

1. When there are components with high heat value,To add Heat sink(cooler/fan/radiator) or Heat-conducting plate.

2. Heat dissipate by PCB bare board

3. Adopt a reasonable PCB layout design would help out with the heat dissipation.

4. For those devices which cooled by free convective air,It’s better to place the IC(or other components) lengthwise or horizontally onto the PCB board.

5. Try to arrange the components based on their heat value and dissipation degree on a PCB,Those components with low heat value or with bad heat resistance(Such as Transistors,IC,Capacitors ect),To place them on the upper part of the cooling flow(inlet).And those components with high heat value or with good heat resistance(Such as power transistors,large scale integrated circuits ect),To put them at the downstream of the cooling flow.

6. In the horizontal direction,To place the high-power components as close as possible to the edge of the PCB,To shorten the heat transfer path,And in the vertical direction,To place the high-power components as close as possible to the top of the PCB,So as to reduce the high heat influence to other low-power components.

7. For those components which sensitive to the temperature,It’s better to place them on the lowest temperature zone(Such as the bottom of the PCB),Don’t put them over the high heat value components,To interleave Multiple components in horizontal.


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