The baking process for components

The baking process for components

The main objective of ‘baking process’ to remove the moisture content available in particular electronic devices like moisture sensitive parts.The major concern with moisture sensitive plastic packaging around the part will absorb water when it comes time to assemble circuit board and the part undergoes reflow soldering that absorbed can have destructive effects due to high temperature of the reflow process so that moisture causes water bubbles to form inside of the plastic packaging. The force of these bubbles deforms the part and often damages the internal components.

The shelf life of the components decrease due to the component moisture sensitivity so as you need to extend its shelf life actually shelf life depends on the moisture sensitive level. The higher the moisture sensitivity level have rapidly the part will absorb water.

Classifications of Moisture Sensitivity Level

Moisture sensitive level classification depends on raw material of the components and components floor life time from out of bag.

1.MSL 6 – Mandatory bake before use

2.MSL 5A – 24hours

3.MSL 5 – 48hours

4.MSL 4 – 72hours

5.MSL 3 – 168hours

6.MSL 2A – 4weeks

7.MSL 2 – 1year

8.MSL 1 – unlimited

And also baking process depends on following factors

1.Moisture Sensitivity Level(MSL)

2.Component Body Thickness

3.Length of time since components floor life has expired

4.Baking process different for BGA and Stacked Die Packages

Baking Conditions:

1.Baking performed must in high accuracy temperature

2.Humidity controlled environmental chamber

Baking Process for Different Components:

The baking is the process of removing the moisture content from particular components in order to effective usage in production line.

The baking process procedure is different for components its depends on moisture sensitivity level

Baking of MSD components divided into two types

1.Pre baking

2.Post baking

--Pre baking: Pre baking is used to prepare components for dry packing

--Post baking: Post baking is used to recondition components after floor life expiration.

You must use caution when determining the bake temperature and time, improper baking can cause poor solderabilty by damaging the leads through oxidation. It’s important to have an understanding of proper baking temperature. Below

--MSL 6 parts can only be left out for 6 hours before baking is required.

We mention below is exact baking process for different components body thickness