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  • Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board
  • Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board
Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board

Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board

  • Product No.:2021617144335
  • PCB board thickness:5.8mm
  • Layer count:4L
  • PCB material:FR4+F4BM-2
  • Copper thickness:1OZ
  • Surface treatment:ENIG 2
  • Soldermask:Green
  • silkscreen:White
  • D.K:2.65
  • Online Inquiry

Mixed dielectric Thicker PCB with F4BM-2 + FR4 hybrid laminate type 5.8mm RF circuit board 

Product details:
Special requirement for the PCB is as below:
1.F4BM-2 with thick 5.0mm and FR4 with 0.8mm
2.Mixed laminate with different DK value,FR4 mixed with F4BM-2
3.Large size 382mm*368mm 
4.PCB assembly is required at the same time





PCB Material introduction:
F4BM-2-A is laminated by laying up of the imported varnished glass cloth with the Nano-ceramic membrane and Teflon resin,according to the scientific formulation and strict technology process. This product takes advantages over F4BM series in the electrical performance and the surface insulation resistance stability.
Click at here download the F4BM-2 material specification file.

ENIG Surface finish
ENIG has become the most highly-used finish in the PCB industry since the growth and implementation of the RoHS regulation.More details click at here:What is ENIG?

Pros:

  • Flat surfaces
  • strong
  • Lead-Free
  • Good for PTH(Plated Through-holes)
  • Long Shelf Life
Cons:
  • Black Pad / Black Nickel
  • Expensive
  • Not Re-workable
  • Damage from ET
  • Signal Loss (RF)
  • Limited availability
  • Complicated Process(Two-parts)